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Compared with other packaging technology, COB technology, low price (only about 1/3 of the same chip), to save space, mature technology. But any new technology first appeared can not be perfect, COB …View More
Update: 11:11   05/19-2013  |  Views:5660
COB packaging process: Step 1: expanding crystal. Expansion machine manufacturers will provide the entire LED chip the film uniformity expansion, attached to the surface of the film closely spaced L…View More
Update: 21:21   05/18-2013  |  Views:5956
COB chip-on-board (Chip On Board COB) process is first covered the surface of the substrate with a thermally conductive epoxy resin (epoxy resin is generally doped with silver particles) the wafer pl…View More
Update: 20:20     |  Views:7137
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